AMD/Xilinx XC6SLX16-3FG900I FPGAs (Field Programmable Gate Array)
Field Programmable Gate Array (FPGA) featuring 14,579 logic cells and 18,224 registers, built on 45nm process technology.
Same model may have multiple batches, images only for reference.
Technical Specifications
AMD/Xilinx XC6SLX16-3FG900I FPGAs (Field Programmable Gate Array) technical specifications.
General
Alternate Parts Comparison (XC6SLX16-3FG900I vs XC6SLX16-2CSG225I vs XC6SLX16-2CSG225C vs XC6SLX16-3CSG225C)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C | -40°C ~ 100°C (TJ) | 0°C ~ 85°C | 0°C ~ 85°C |
| Package | FBGA | 225-LFBGA, CSPBGA | CSBGA | CSBGA |
| Number of Pins | 900 | -- | 225 | 225 |
| RoHS | No | -- | Yes | Yes |
| AEC Qualified | No | -- | No | No |
| Automotive | No | -- | No | No |
| Basic Package Type | Ball Grid Array | -- | Ball Grid Array | Ball Grid Array |
| Cage Code | 68994 | -- | 68994 | 68994 |
| Dedicated DSP | 32 | -- | 32 | 32 |
| Device Logic Cells | 14579 | -- | 14579 | 14579 |
| Device Number of Dlls Plls | 6 | -- | 6 | 6 |
| Action |
AMD/Xilinx XC6SLX16-3FG900I FPGAs (Field Programmable Gate Array) Overview
Field Programmable Gate Array (FPGA) featuring 14,579 logic cells and 18,224 registers, built on 45nm process technology. This device offers 576 Kbit of RAM, 64 dedicated 18x18 multipliers, and 32 DSP blocks. It includes 576 user I/Os and operates with a transceiver speed of 3.2 Gbps.
The component is housed in a 900-pin, 31mm x 31mm x 1.75mm Fine Pitch Ball Grid Array (FBGA) package for surface mounting, with an operating temperature range of -40°C to 100°C.
More Parts in FPGAs (Field Programmable Gate Array)
XC6SLX16-2FT256IAMD/XilinxXC6SLX16-2FTG256CAMD/XilinxXC6SLX16-2CSG324CAMD/XilinxXC6SLX16-2CSG225CAMD/Xilinx