AMD/Xilinx XC6SLX100T-3FGG676I FPGAs (Field Programmable Gate Array)
IC FPGA 376 I/O 676FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC6SLX100T-3FGG676I
Category
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP slices. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27mm for surface mounting, with a pin pitch of 1mm. Operates across a temperature range of -40°C to 100°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
XC6SLX100T-3FGG676I Datasheet
Quick Jump:
Technical Specifications
AMD/Xilinx XC6SLX100T-3FGG676I FPGAs (Field Programmable Gate Array) technical specifications.
General
Series
XC6SLX100T
RoHS
Yes
Number of Pins
676
Package / Case
676-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Alternate Parts Comparison (XC6SLX100T-3FGG676I vs XC6SLX100-3CSG484I vs XC6SLX100-2FGG676I vs XC6SLX100-L1FGG676C)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 85°C |
| Package | FBGA | 484-FBGA, CSPBGA | FBGA | FBGA |
| Number of Pins | 676 | -- | 676 | 676 |
| RoHS | Yes | Yes | Yes | Yes |
| AEC Qualified | No | -- | No | No |
| Automotive | No | -- | No | No |
| Basic Package Type | Ball Grid Array | -- | Ball Grid Array | Ball Grid Array |
| Cage Code | 68994 | -- | 68994 | 68994 |
| Dedicated DSP | 180 | -- | 180 | 180 |
| Device Logic Cells | 101261 | -- | 101261 | 101261 |
| Device Number of Dlls Plls | 18 | -- | 18 | 18 |
| Action |
AMD/Xilinx XC6SLX100T-3FGG676I FPGAs (Field Programmable Gate Array) Overview
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP slices. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27mm for surface mounting, with a pin pitch of 1mm.
Operates across a temperature range of -40°C to 100°C.
More Parts in FPGAs (Field Programmable Gate Array)
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.
XC6SLX100-L1FGG676CAMD/XilinxField Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology.