AMD/Xilinx XC6SLX100T-3FG676I FPGAs (Field Programmable Gate Array)
IC FPGA 376 I/O 676FCBGA
Same model may have multiple batches, images only for reference.
Technical Specifications
AMD/Xilinx XC6SLX100T-3FG676I FPGAs (Field Programmable Gate Array) technical specifications.
General
Related Parts Comparison (XC6SLX100T-3FG676I vs XC6SLX100-3CSG484I vs XC6SLX100-2FGG676I vs XC6SLX100-L1FGG676C)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 85°C |
| RoHS | No | Yes | Yes | Yes |
| Package | FBGA | 484-FBGA, CSPBGA | FBGA | FBGA |
| Package / Case | 676-BGA | 484-FBGA | 676-BGA | -- |
| Supply Voltage | 1.14V ~ 1.26V | 1.14V ~ 1.26V | 1.14V ~ 1.26V | -- |
| Number of Pins | 676 | -- | 676 | 676 |
| Lifecycle Status | Active | Active | Active | -- |
| AEC Qualified | No | -- | No | No |
| Automotive | No | -- | No | No |
| Basic Package Type | Ball Grid Array | -- | Ball Grid Array | Ball Grid Array |
| Cage Code | 68994 | -- | 68994 | 68994 |
| Action |
AMD/Xilinx XC6SLX100T-3FG676I FPGAs (Field Programmable Gate Array) Overview
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP slices. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. This surface-mount device is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27x27x1.73mm with a 1mm pin pitch.
Operates across a temperature range of -40°C to 100°C.
More Parts in FPGAs (Field Programmable Gate Array)
XC6SLX100-L1FGG676CAMD/Xilinx