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AMD/Xilinx XC6SLX100-L1FG676C FPGAs (Field Programmable Gate Array)

IC FPGA 480 I/O 676FCBGA

In Stock ActiveAMD/XilinxXC6SLX100FBGARoHS
XC6SLX100-L1FG676C FBGA package illustration

Same model may have multiple batches, images only for reference.

XC6SLX100-L1FG676C
Manufacturer
Part Number (MPN)
XC6SLX100-L1FG676C
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. This device features 480 maximum user I/Os, 4824 Kbit RAM bits, and 360 18x18 multipliers. It includes 180 dedicated DSP blocks and 18 DLLs/PLLs, with 268 total Block RAM. The FPGA operates within a 0 °C to 85 °C temperature range and supports transceiver speeds up to 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27x1.73 mm, it is designed for...
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
No
Datasheet
PDF XC6SLX100-L1FG676C Datasheet
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Ordering Code Family

XC6SLX100 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

120 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX100-L1FG676C FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
No
Number of Pins
676
Package / Case
676-BGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA

Alternate Parts Comparison (XC6SLX100-L1FG676C vs XC6SLX100-3CSG484I vs XC6SLX100T-3FGG484I vs XC6SLX100T-2FGG484I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case676-BGA484-FBGA484-BBGA484-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)-40°C ~ 100°C (TJ)
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
RoHSNoYesYesYes
Lifecycle StatusActiveActiveActiveActive
Number of I/O480338296296
Number of LABs/CLBs7911791179117911
Number of Logic Elements Cells101261101261101261101261
PackageFBGA484-FBGA, CSPBGAFBGAFBGA
Total RAM Bits4939776493977649397764939776
Number of Pins676--484484
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AMD/Xilinx XC6SLX100-L1FG676C FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. This device features 480 maximum user I/Os, 4824 Kbit RAM bits, and 360 18x18 multipliers. It includes 180 dedicated DSP blocks and 18 DLLs/PLLs, with 268 total Block RAM.

The FPGA operates within a 0 °C to 85 °C temperature range and supports transceiver speeds up to 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27x1.73 mm, it is designed for...

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