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AMD/Xilinx XC6SLX100-3FG676I FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology.

In Stock ActiveAMD/XilinxXC6SLX100FBGARoHS
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XC6SLX100-3FG676I
Manufacturer
Part Number (MPN)
XC6SLX100-3FG676I
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 480 user I/Os, 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. Operates with 1.2V supply and offers transceiver speeds up to 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27x1.73mm with a 1mm pin pitch, suitable for surface mounting. Extended operating temperature range from -40°C to 100°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
No
Datasheet
PDF XC6SLX100-3FG676I Datasheet
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Ordering Code Family

XC6SLX100 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

120 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX100-3FG676I FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS
No
Number of Pins
676
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pcb
676

Alternate Parts Comparison (XC6SLX100-3FG676I vs XC6SLX100-3CSG484I vs XC6SLX100T-3FGG484I vs XC6SLX100T-2FGG484I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C-40°C ~ 100°C (TJ)-40°C ~ 100°C-40°C ~ 100°C
PackageFBGA484-FBGA, CSPBGAFBGAFBGA
Number of Pins676--484484
RoHSNo--YesYes
AEC QualifiedNo--NoNo
AutomotiveNo--NoNo
Basic Package TypeBall Grid Array--Ball Grid ArrayBall Grid Array
Cage Code68994--6899468994
Dedicated DSP180--180180
Device Logic Cells101261--101261101261
Device Number of Dlls Plls18--1818
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AMD/Xilinx XC6SLX100-3FG676I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 480 user I/Os, 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. Operates with 1.2V supply and offers transceiver speeds up to 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27x1.73mm with a 1mm pin pitch, suitable for surface mounting.

Extended operating temperature range from -40°C to 100°C.

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