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AMD/Xilinx XC3S1400A-4FGG676C FPGAs (Field Programmable Gate Array)

IC FPGA 502 I/O 676FBGA

2,950 ActiveAMD/XilinxXC3S1400676-BGA$161.18
XC3S1400A-4FGG676C 676-BGA package illustration

Same model may have multiple batches, images only for reference.

XC3S1400A-4FGG676C
Manufacturer
Part Number (MPN)
XC3S1400A-4FGG676C
Base Model
Detailed Description
IC FPGA 502 I/O 676FBGA
Package
676-BGA
Key Features
Package: 676-BGA; Supply Voltage: 1.14V ~ 1.26V
Lifecycle Status
Active
Datasheet
PDF XC3S1400A-4FGG676C Datasheet
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Ordering Code Family

XC3S1400 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

5 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC3S1400A-4FGG676C FPGAs (Field Programmable Gate Array) technical specifications.

General

Series
XC3S1400A
RoHS
Yes
Package / Case
676-BGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Package
676-BGA
Number of I/O
502
Number of LABs/CLBs
2816

Alternate Parts Comparison (XC3S1400A-4FGG676C vs XC3S1400AN-4FGG484C vs XC3S1400AN-4FGG484I vs XC3S1400A-4FTG256C)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesXC3S1400AXC3S1400ANXC3S1400ANXC3S1400A
Package / Case676-BGA484-BBGA484-BBGA256-LBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 85°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
RoHSYesYesYesYes
Lifecycle StatusActiveObsoleteObsoleteActive
Collector Emitter Saturation Voltage1 V1 V1 V1 V
Distributed RAM176 kbit176 kbit176 kbit176 kbit
Embedded Block RAM Ebr576 kbit576 kbit576 kbit576 kbit
Maximum Operating Temperature C+ 85+ 85+ 100+ 85
Minimum Operating Temperature C00- 400
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