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DRAM

DRAM (Dynamic Random-Access Memory) provides high-density, high-bandwidth volatile storage for computing systems, display buffers, and network packet processing. This category covers SDR, DDR, DDR2, DDR3, DDR4, DDR5, LPDDR, and Mobile SDRAM ICs from Micron, Samsung, Alliance Memory, ISSI, and Intelligent Memory.

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Browse DRAM Products

Showing 391–400 of 6,150 products
PART NUMBERMANUFACTURERDESCRIPTIONSTOCKQTY / ACTION
MT49H16M18CFM-5Micron Technology Inc.Package: Tray | Mounting Type: SMD (SMT) | Memory Size: 288Mb (16M x 18) | Fbga Marking Code: D9BPH | Status: Obsolete(EOL) | Max Frequency: 200MHz8,500
MT49H16M18BM-25Micron Technology Inc.Supply Voltage: 1.8 V | Number of Pins: 144 | Fbga Marking Code: D9FXG | Max Frequency: 400 MHz | Nominal Supply Current: 408 mA | Min Operating Temp: 0 °C347
K4M56323PI-HG75Samsung SemiconductorPackage / Case: FBGA | Mounting Type: Surface Mount | Supply Voltage: 1.8V | Organization: 8MX324,230
MT4LC4M16R6TG-5Micron Technology Inc.Estimated Eol Date: Obsolete / End of life | ECCN: EAR99 | Family: Memory | Family Name: MT4LC4M16R6 | Introduction Date: June 23, 2000105
IS43TR81280AL-125JBLIISSI®Package: BGA | Mounting Type: SMD (SMT) | RoHS: Non-Compliant10
EDE1116AEBG-8E-FMicron Technology Inc.Estimated Eol Date: Obsolete / End of life | ECCN: EAR99 | Family: Memory | Family Name: EDE1116AEBG | Introduction Date: April 02, 20077,297
B4064B3PD-8D-FMicron Technology Inc.Package: Tray | Mounting Type: SMD (SMT) | Memory Size: 4Gb (64M x 64) | Status: Obsolete(EOL) | Max Frequency: 400MHz | Technology: SDRAM - Mobile LPDDR2In Stock
EDB4064B3PD-8D-FMicron Technology Inc.Package: Tray | Mounting Type: SMD (SMT) | Memory Size: 4Gb (64M x 64) | Status: Obsolete(EOL) | Max Frequency: 400MHz | Technology: SDRAM - Mobile LPDDR25,300
IS43R16160D-6BIISSI®Package / Case: 60-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.3V ~ 2.7V | Memory Size: 256Mb (16M x 16) | Operating Temperature: -40°C ~ 85°C (TA)In Stock
EDFA232A2MA-GD-F-RMicron Technology Inc.Memory Size: 16Gb (512M x 32) | Status: Obsolete(EOL) | Max Frequency: 800MHz | Technology: SDRAM - Mobile LPDDR3 | Supply Voltage Operating: 1.14 V to 1.95 V | Memory Type: Volatile6,000

How to Choose DRAM

A practical selection framework for DRAM covering specifications, packaging, lifecycle, and sourcing on Octatronics.

  1. Define electrical and environmental requirements

    Start with the required function and operating conditions for DRAM, then lock in critical parameters such as function, supply voltage, interface, package, and temperature grade. Match these against datasheet limits, not catalog summaries alone.

  2. Validate package and land pattern compatibility

    Confirm the DRAM package matches your PCB footprint, pick-and-place constraints, and moisture sensitivity handling. Verify reel/tape or tube packaging for production.

  3. Check lifecycle, compliance, and alternates

    Review lifecycle status (Active, NRND, EOL), RoHS, and approved alternate sources for DRAM before committing to high-volume builds. Use Octatronics cross-reference data when a drop-in replacement is needed.

  4. Compare manufacturers and request pricing

    Filter DRAM by manufacturers such as ROHM and Renesas, compare key specs side by side, then submit an RFQ with quantity, target delivery, and traceability requirements.

About DRAM

Frequently Asked Questions

Octatronics can help source a wide range of DRAM from major manufacturers worldwide, including active production parts, long-lead-time items, and hard-to-find components.

Yes. You can submit a single part number or upload a BOM with multiple parts. Our team will check stock, date code, lead time, and pricing for each item.

Availability depends on the specific part number and supplier source. For important orders, buyers can request packaging photos, labels, date code information, and traceability documents.

Yes. Octatronics supports sourcing for active, end-of-life, obsolete, and hard-to-find components through our global supplier network.

Please provide the part number, manufacturer, quantity, required date code, target price, delivery country, and whether original packaging or COC is required.

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Learn how to choose electronic components for reliable hardware design, including specifications, lifecycle status, sourcing risks, quality checks, and BOM optimization.

Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing

When an original electronic component becomes obsolete, unavailable, or too expensive, a pin-to-pin replacement part can help avoid PCB redesign and keep production or repair projects moving. However, pin-to-pin compatibility does not automatically mean the part is a safe drop-in replacement. This guide explains how to check package, footprint, pinout, electrical ratings, thermal performance, timing behavior, firmware requirements, compliance status, and lifecycle risk before sourcing replacement parts. It also provides a practical checklist to help engineers, buyers, and maintenance teams reduce sourcing mistakes and verify compatibility before purchase.

How to Find Pin-Compatible Alternatives for Obsolete ICs

Finding a pin-compatible alternative for an obsolete IC is not just about matching the package. It requires a structured review of pinout, footprint, electrical parameters, functional behavior, lifecycle status, sourcing reliability, and sample validation.

DDR6 RAM: What We Know So Far About Next-Generation Memory

DDR6 RAM is the next planned generation of DDR memory technology after DDR5, designed to support higher bandwidth, improved efficiency, and future computing platforms with greater data movement requirements. Although DDR6 is not yet a mainstream commercial product, major memory manufacturers and platform developers are already preparing for the next stage of DRAM evolution.