Skip to main content

DRAM

DRAM (Dynamic Random-Access Memory) provides high-density, high-bandwidth volatile storage for computing systems, display buffers, and network packet processing. This category covers SDR, DDR, DDR2, DDR3, DDR4, DDR5, LPDDR, and Mobile SDRAM ICs from Micron, Samsung, Alliance Memory, ISSI, and Intelligent Memory.

Request Quote
6,150+Products
10+Manufacturers
100%Original & New
GlobalDelivery

Browse DRAM Products

Showing 281–290 of 6,150 products
PART NUMBERMANUFACTURERDESCRIPTIONSTOCKQTY / ACTION
MT40A512M16TB-062EIT:RMicron Technology Inc.Package: Tray | Package / Case: FBGA-96 | Memory Size: 8 Gbit | Organization: 512 M x 163,300
MT47H64M16HR-2G:HMicron Technology Inc.Package: FBGA | Fbga Marking Code: D9LVL | RoHS: Compliant200
W949D2KBJX5IWinbond ElectronicsPackage: TFBGA | Mounting Type: SMD (SMT) | Interface: Parallel | Min Operating Temp: -40 °C | Frequency: 200 MHz | Max Operating Temp: 85 °C7,060
MSM5118160F-60JROHMPackage: Tray | Memory Size: 16Mb (1M x 16) | Status: Obsolete(EOL) | Access Time: 30ns | Technology: DRAM | Supply Voltage Operating: 4.5 V to 5.5 VIn Stock
W632GG6KB15JWinbond ElectronicsPackage: 96-TFBGA | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 2Gb (128M x 16) | Operating Temperature: -40°C ~ 105°C (TC)210
MSM5118165F-60T3-KROHMPackage: Tray | Mounting Type: SMD (SMT) | Memory Size: 16Mb (1M x 16) | Status: Active | Access Time: 30ns | Technology: DRAM63
W971GG8JB-25IWinbond ElectronicsPackage: Tray | Mounting Type: SMD (SMT) | Memory Size: 1Gb (128M x 8) | Status: Obsolete(EOL) | Max Frequency: 200MHz | Access Time: 400ps2,342
K4M56163LG-BN75Samsung SemiconductorNumber of Pins: 54 | Max Operating Temp: 85 | Min Operating Temp: -25 | Terminal Position: BOTTOM | Jedec Package Code: S-PBGA-B54 | Temperature Grade: OTHER12,312
W9412G6JH-5Winbond ElectronicsPackage: Tray | Mounting Type: SMD (SMT) | Memory Size: 128Mb (8M x 16) | Status: Obsolete(EOL) | Max Frequency: 200MHz | Access Time: 50ns200
W971GG6JB-25Winbond ElectronicsEstimated Eol Date: Obsolete | ECCN: EAR99 | Family: Memory | Family Name: W971GG6JB | Introduction Date: February 06, 200943,820

How to Choose DRAM

A practical selection framework for DRAM covering specifications, packaging, lifecycle, and sourcing on Octatronics.

  1. Define electrical and environmental requirements

    Start with the required function and operating conditions for DRAM, then lock in critical parameters such as function, supply voltage, interface, package, and temperature grade. Match these against datasheet limits, not catalog summaries alone.

  2. Validate package and land pattern compatibility

    Confirm the DRAM package matches your PCB footprint, pick-and-place constraints, and moisture sensitivity handling. Verify reel/tape or tube packaging for production.

  3. Check lifecycle, compliance, and alternates

    Review lifecycle status (Active, NRND, EOL), RoHS, and approved alternate sources for DRAM before committing to high-volume builds. Use Octatronics cross-reference data when a drop-in replacement is needed.

  4. Compare manufacturers and request pricing

    Filter DRAM by manufacturers such as ROHM and Renesas, compare key specs side by side, then submit an RFQ with quantity, target delivery, and traceability requirements.

About DRAM

Frequently Asked Questions

Octatronics can help source a wide range of DRAM from major manufacturers worldwide, including active production parts, long-lead-time items, and hard-to-find components.

Yes. You can submit a single part number or upload a BOM with multiple parts. Our team will check stock, date code, lead time, and pricing for each item.

Availability depends on the specific part number and supplier source. For important orders, buyers can request packaging photos, labels, date code information, and traceability documents.

Yes. Octatronics supports sourcing for active, end-of-life, obsolete, and hard-to-find components through our global supplier network.

Please provide the part number, manufacturer, quantity, required date code, target price, delivery country, and whether original packaging or COC is required.

Articles & Technology

View All →
How to Choose Electronic Components for Reliable Hardware Design

How to Choose Electronic Components for Reliable Hardware Design

Learn how to choose electronic components for reliable hardware design, including specifications, lifecycle status, sourcing risks, quality checks, and BOM optimization.

Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing

When an original electronic component becomes obsolete, unavailable, or too expensive, a pin-to-pin replacement part can help avoid PCB redesign and keep production or repair projects moving. However, pin-to-pin compatibility does not automatically mean the part is a safe drop-in replacement. This guide explains how to check package, footprint, pinout, electrical ratings, thermal performance, timing behavior, firmware requirements, compliance status, and lifecycle risk before sourcing replacement parts. It also provides a practical checklist to help engineers, buyers, and maintenance teams reduce sourcing mistakes and verify compatibility before purchase.

How to Find Pin-Compatible Alternatives for Obsolete ICs

Finding a pin-compatible alternative for an obsolete IC is not just about matching the package. It requires a structured review of pinout, footprint, electrical parameters, functional behavior, lifecycle status, sourcing reliability, and sample validation.

DDR6 RAM: What We Know So Far About Next-Generation Memory

DDR6 RAM is the next planned generation of DDR memory technology after DDR5, designed to support higher bandwidth, improved efficiency, and future computing platforms with greater data movement requirements. Although DDR6 is not yet a mainstream commercial product, major memory manufacturers and platform developers are already preparing for the next stage of DRAM evolution.