Winbond Electronics W632GG6KB15J DRAM
IC DRAM 2GBIT PARALLEL 96WBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W632GG6KB15J
Detailed Description
Package
96-TFBGA
Key Features
Package: 96-TFBGA; Package / Case: 96-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.425V ~ 1.575V; Memory Size: 2Gb (128M x 16)
Lifecycle Status
Unknown
RoHS State
Unknown
Datasheet
W632GG6KB15J Datasheet
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Technical Specifications
Winbond Electronics W632GG6KB15J DRAM technical specifications.
General
Mounting Type
Surface Mount
MSL Level
3 (168 Hours)
Quantity Per Package
190
Reach Status
REACH Unaffected
Operating Temperature Range
-40°C ~ 105°C (TC)
ECCN
EAR99
Features
SDRAM - DDR3 Memory IC 2Gb (128M x 16) Parallel 667 MHz 20 ns 96-WBGA (9x13)
HTSUS
8542.32.0036
Package
96-TFBGA
Operating Temperature
-40°C ~ 105°C (TC)
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