Winbond Electronics W988D2FBJX7E DRAM
IC DRAM 256MBIT PAR 90VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W988D2FBJX7E
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 90-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 256M; Interface: LVCMOS
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W988D2FBJX7E DRAM technical specifications.
General
RoHS
Compliant
ECCN
4A994a.
Lifecycle Status
Obsolete
HTS
8542.32.00.24
Automotive
No
Ppap
No
Dram Type
Mobile LPSDR SDRAM
Memory Size
256M
Organization
8Mx32
Number of Internal Banks
4
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