Winbond Electronics W987D6HBGX6E Memory ICs
IC DRAM 128MBIT PARALLEL 54VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W987D6HBGX6E
Detailed Description
Package
54-TFBGA
Key Features
Package: 54-TFBGA; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 128Mb (8M x 16)
Lifecycle Status
Last Time Buy
RoHS State
Unknown
Datasheet
W987D6HBGX6E Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W987D6HBGX6E Memory ICs technical specifications.
General
Operating Temperature
-25°C ~ 85°C (TC)
Mounting Type
Surface Mount
Package
54-TFBGA
Technology
SDRAM - Mobile LPSDR
Supplier Device Package
54-VFBGA (8x9)
Memory Size
128Mb (8M x 16)
Memory Type
Volatile
Supply Voltage
1.7V ~ 1.95V
Max Frequency
166 MHz
Access Time
5.4 ns
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