Winbond Electronics W97BH2KBQX2I DRAM
DRAM Chip Mobile LPDDR2 SDRAM 2Gbit 64Mx32 1.8V/1.2V 168-Pin WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W97BH2KBQX2I
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 168-WFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.14V ~ 1.95V; Memory Size: 2G; Interface: HSUL_12
Lifecycle Status
Active-Unconfirmed
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W97BH2KBQX2I DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Active-Unconfirmed
HTS
COMPONENTS
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR2 SDRAM
Memory Size
2G
Organization
64Mx32
Number of Internal Banks
8
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