Winbond Electronics W97BH2KBQX2E DRAM
DRAM Chip Mobile LPDDR2 SDRAM 2Gbit 64Mx32 1.8V/1.2V 168-Pin WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W97BH2KBQX2E
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 168-WFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.14V ~ 1.95V; Memory Size: 2G; Interface: HSUL_12
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W97BH2KBQX2E DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Active
HTS
8542.32.00.36
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR2 SDRAM
Memory Size
2G
Organization
64Mx32
Number of Internal Banks
8
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