Winbond Electronics W979H2KBVX1I DRAM
IC DRAM 512MBIT HSUL 12 134VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W979H2KBVX1I
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 134-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.14V ~ 1.3V, 1.7V ~ 1.95V; Memory Size: 512M; Interface: HSUL_12
Lifecycle Status
LTB
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W979H2KBVX1I DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
LTB
HTS
8542.32.00.28
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR2 SDRAM
Memory Size
512M
Organization
16Mx32
Number of Internal Banks
4
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