Winbond Electronics W979H2KBVX1E DRAM
IC DRAM 512MBIT HSUL 12 134VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W979H2KBVX1E
Detailed Description
Package
134-VFBGA (10x11.5)
Key Features
Package: Tray; Package / Case: 134-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.14V ~ 1.3V, 1.7V ~ 1.95V; Memory Size: 512Mbit
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W979H2KBVX1E DRAM technical specifications.
General
Max Frequency
533 MHz
Operating Temperature
-25°C ~ 85°C (TC)
Memory Interface
HSUL_12
ECCN
EAR99
Memory Organization
16M x 32
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Not For New Designs
Supplier Device Package
134-VFBGA (10x11.5)
Series
W979H2KB
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