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Winbond Electronics W979H2KBQX2I DRAM

IC DRAM 512M PARALLEL 168WFBGA

8,800Winbond ElectronicsBGA$13.95RoHS
W979H2KBQX2I - No Image Available

Same model may have multiple batches, images only for reference.

W979H2KBQX2I
Part Number (MPN)
W979H2KBQX2I
Detailed Description
IC DRAM 512M PARALLEL 168WFBGA
Package
BGA
Lifecycle Status
Last Time Buy
RoHS State
RoHS Compliant
Datasheet
PDF W979H2KBQX2I Datasheet
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Technical Specifications

Winbond Electronics W979H2KBQX2I DRAM technical specifications.

General

Interface
HSUL_12
Memory Size
512M
RoHS
Compliant
Number of Pins
168
Package / Case
168-WFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.14V ~ 1.95V
Lifecycle Status
LTB
Automotive
No

Alternate Parts Comparison (W979H2KBQX2I vs W634GU6RB-11 vs W634GU6MB-12 vs W9751G6NB-25)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)0 ~ 950 ~ 950 ~ 85
Supply Voltage1.14V ~ 1.95V1.283 ~ 1.451.283 ~ 1.451.7 ~ 1.9
Memory Size512M4G4G512M
Number of Pins168969684
RoHSCompliantCompliantCompliantCompliant
Lifecycle StatusLTBActiveObsoleteActive
Address Bus Width Bit15181815
AutomotiveNoNoNoNo
Data Bus Width Bit32161616
Dram TypeMobile LPDDR2 SDRAMDDR3L SDRAMDDR3L SDRAMDDR2 SDRAM
Maximum Access Time Ns5.50.1950.2250.4
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