Winbond Electronics W978H6KBVX2E DRAM
IC DRAM 256MBIT PAR 134VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W978H6KBVX2E
Detailed Description
IC DRAM 256MBIT PAR 134VFBGA
Package
BGA
Lifecycle Status
Last Time Buy
RoHS State
RoHS Compliant
Datasheet
W978H6KBVX2E Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W978H6KBVX2E DRAM technical specifications.
General
Interface
HSUL_12
Memory Size
256M
RoHS
Compliant
Number of Pins
134
Package / Case
134-VFBGA
Mounting Type
Surface Mount
Operating Temperature
-25°C ~ 85°C (TC)
Supply Voltage
1.14V ~ 1.95V
Lifecycle Status
LTB
Automotive
No
Alternate Parts Comparison (W978H6KBVX2E vs W634GU6RB-11 vs W634GU6MB-12 vs W9751G6NB-25)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -25°C ~ 85°C (TC) | 0 ~ 95 | 0 ~ 95 | 0 ~ 85 |
| Supply Voltage | 1.14V ~ 1.95V | 1.283 ~ 1.45 | 1.283 ~ 1.45 | 1.7 ~ 1.9 |
| Memory Size | 256M | 4G | 4G | 512M |
| Number of Pins | 134 | 96 | 96 | 84 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | LTB | Active | Obsolete | Active |
| Address Bus Width Bit | 15 | 18 | 18 | 15 |
| Automotive | No | No | No | No |
| Data Bus Width Bit | 16 | 16 | 16 | 16 |
| Dram Type | Mobile LPDDR2 SDRAM | DDR3L SDRAM | DDR3L SDRAM | DDR2 SDRAM |
| Maximum Access Time Ns | 5.5 | 0.195 | 0.225 | 0.4 |
| Action |
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