Winbond Electronics W978H2KBVX2I DRAM
IC DRAM 256MBIT PAR 134VFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W978H2KBVX2I
Detailed Description
Package
134-VFBGA (10x11.5)
Key Features
Package: Tray; Package / Case: 134-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.14V ~ 1.95V; Memory Size: 256Mbit
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W978H2KBVX2I DRAM technical specifications.
General
Max Frequency
400 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Parallel
ECCN
EAR99
Memory Organization
8M x 32
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Not For New Designs
Supplier Device Package
134-VFBGA (10x11.5)
Series
W978H2KB
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W97AH2KBVX2IWinbond ElectronicsPackage: Tray | Package / Case: 134-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)
W978H6KBVX1IWinbond ElectronicsPackage: Tray | Package / Case: 134-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.3V, 1.7V ~ 1.95V | Memory Size: 256Mbit | Operating Temperature: -40°C ~ 85°C (TC) | Organization: 16 M x 16
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W97AH2NBVA1EWinbond ElectronicsPackage: Tray | Package / Case: 134-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.3V, 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TC) | Organization: 32 M x 32