Winbond Electronics W9712G6KB25I DRAM
IC DRAM 128MBIT PAR 84TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W9712G6KB25I
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 128M; Interface: SSTL_18
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W9712G6KB25I DRAM technical specifications.
General
RoHS
Compliant
Inventory Source
Winsource
Inventory Source File
/Volumes/T7 Shield/电子元器件数据/抓取的数据/Win-Source数据/winsource_未曾下架数据_202605_1.xlsx
Inventory As of
2026-05-15
Source Manufacturer
Winbond Electronics
Source Category
Integrated Circuits (ICs) > Memory
Stock
1018
Extracted Price
2.0478
Price Formula
winsource min price * 2
ECCN
EAR99
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W9751G6NB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16
W634GU6RB-11Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
W9725G6KB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 256M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 16Mx16
W9751G6NB25IWinbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16