Winbond Electronics W957D8MFYA5I DRAM
IC DRAM 128MBIT HYPERBUS 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W957D8MFYA5I
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 24-TBGA; Mounting Type: Surface Mount; Supply Voltage: 3V ~ 3.6V; Memory Size: 128M; Interface: HyperBus
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
W957D8MFYA5I Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W957D8MFYA5I DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Active
HTS
8542.32.00.02
Automotive
No
Ppap
No
Dram Type
Mobile-DDR SDRAM
Memory Size
128M
Organization
16Mx8
Number of Bits Word Bit
8
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W9751G6NB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16
W634GU6RB-11Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
W9725G6KB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 256M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 16Mx16
W9751G6NB25IWinbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16