Winbond Electronics W955D8MBYA6I DRAM
Mobile DRAM Chip
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W955D8MBYA6I
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 32M; Interface: HyperBus
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W955D8MBYA6I DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Obsolete
HTS
EA
Automotive
No
Ppap
No
Dram Type
DDR SDRAM
Memory Size
32M
Organization
4Mx8
Number of Bits Word Bit
8
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