Winbond Electronics W71NW11GC1DW DRAM
MCP 64Mx16 Flash + 32Mx16 DDR DRAM 1.8V 130-Pin VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W71NW11GC1DW
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount
Lifecycle Status
Unconfirmed
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W71NW11GC1DW DRAM technical specifications.
General
RoHS
Compliant
ECCN
3A991b.1.a.
Lifecycle Status
Unconfirmed
HTS
8542.32.00.71
Automotive
No
Ppap
No
Flash Memory Size Bit
1G
Sram Memory Size Bit
512M
Organization
64Mx16 Flash + 32Mx16 DDR DRAM
Programmability
Yes
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