Winbond Electronics W66CQ2NQUAGJ DRAM
IC DRAM 4GBIT LVSTL 11 200WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66CQ2NQUAGJ
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 200-WFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V; Memory Size: 4G; Interface: LVSTL_11
Lifecycle Status
LTB
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W66CQ2NQUAGJ DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
LTB
HTS
8542.32.00.36
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR4X SDRAM
Memory Size
4G
Organization
128Mx32
Number of Internal Banks
8
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