Winbond Electronics W66CL2NQUAFI DRAM
DRAM Chip Mobile LPDDR4 SDRAM 4Gbit 128Mx32 1.1V/1.8V 200-Pin WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66CL2NQUAFI
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 4G; Interface: LVSTL_11
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W66CL2NQUAFI DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Obsolete
HTS
8542.32.00.36
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR4 SDRAM
Memory Size
4G
Organization
128Mx32
Number of Internal Banks
8
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