Winbond Electronics W66BP6NBUAHJ DRAM
IC DRAM 2GBIT LVSTL 11 200WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66BP6NBUAHJ
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 200-WFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.06V ~ 1.17V, 1.7V ~ 1.95V; Memory Size: 2Gb (128M x 16)
Lifecycle Status
LTB
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W66BP6NBUAHJ DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
LTB
HTS
EA
Mounting Type
Surface Mount
Package Height
0.47
Package Width
10
Package Length
14.5
Package
BGA
Supplier Package
WFBGA
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