Skip to main content

Winbond Electronics W66BP6NBHAGJ DRAM

2GB LPDDR4, X16, 1866MHZ, -40C~1

In StockWinbond ElectronicsBGARoHS
W66BP6NBHAGJ - No Image Available

Same model may have multiple batches, images only for reference.

W66BP6NBHAGJ
Part Number (MPN)
W66BP6NBHAGJ
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount
Lifecycle Status
LTB
RoHS State
Compliant
Quick Jump:
Ready to order?In stock and ready to ship.
Competitive Pricing
Fast & Reliable Delivery
Quality Assured

Technical Specifications

Winbond Electronics W66BP6NBHAGJ DRAM technical specifications.

General

RoHS
Compliant
ECCN
EAR99
Lifecycle Status
LTB
HTS
EA
Automotive
No
Ppap
No
Mounting Type
Surface Mount
Package Height
0.62
Package Width
7.5
Package Length
10

More in This Category

Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W9751G6NB-25W9751G6NB-25Winbond Electronics
Package: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16
W634GU6RB-11W634GU6RB-11Winbond Electronics
Package: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
W9725G6KB-25W9725G6KB-25Winbond Electronics
Package: BGA | Mounting Type: Surface Mount | Memory Size: 256M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 16Mx16
W9751G6NB25IW9751G6NB25IWinbond Electronics
Package: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16