Winbond Electronics W66BP6NBHAGJ DRAM
2GB LPDDR4, X16, 1866MHZ, -40C~1

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66BP6NBHAGJ
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount
Lifecycle Status
LTB
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W66BP6NBHAGJ DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
LTB
HTS
EA
Automotive
No
Ppap
No
Mounting Type
Surface Mount
Package Height
0.62
Package Width
7.5
Package Length
10
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W9751G6NB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16
Package: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
W9725G6KB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 256M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 16Mx16
W9751G6NB25IWinbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16