Winbond Electronics W66BL6NBUAGI DRAM
DRAM Chip Mobile LPDDR4 SDRAM 2Gbit 128Mx16 1.1V/1.8V 200-Pin WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66BL6NBUAGI
Detailed Description
Package
WFBGA
Key Features
Package: BGA; Package / Case: WFBGA-200; Mounting Type: Surface Mount; Supply Voltage: 1.1/1.8; Memory Size: 2G; Interface: LVSTL_11
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
W66BL6NBUAGI Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W66BL6NBUAGI DRAM technical specifications.
General
Organization
128Mx16
ECCN
EAR99
Ppap
No
Data Bus Width Bit
16
Operating Current Ma
330
Number of Internal Banks
8
Automotive
No
Address Bus Width Bit
17
Min Operating Temp
-40
Max Operating Temp
95
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W9751G6KB-25Winbond ElectronicsPackage: Tray | Package / Case: 84-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.9V | Memory Size: 512Mbit | Operating Temperature: 0°C ~ 85°C (TC)
W9825G6KH-6Winbond ElectronicsPackage: SO | Mounting Type: Surface Mount | Memory Size: 256M | Interface: LVTTL | Number of Pins: 54 | Organization: 16Mx16
W9464G6KH-5Winbond ElectronicsPackage: SO | Package / Case: 66-TSSOP (0.400", 10.16mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.3V ~ 2.7V | Memory Size: 64M | Interface: SSTL_2 | Operating Temperature: 0°C ~ 70°C (TA) | Number of Pins: 66