Winbond Electronics W63CH2MBVACE DRAM
IC DRAM 4GBIT PAR 178VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W63CH2MBVACE
Detailed Description
Package
178-VFBGA (11x11.5)
Key Features
Package: Tray; Package / Case: 178-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.14V ~ 1.3V, 1.7V ~ 1.95V; Memory Size: 4Gbit
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W63CH2MBVACE DRAM technical specifications.
General
Max Frequency
933 MHz
Operating Temperature
-25°C ~ 85°C (TC)
Memory Interface
Parallel
ECCN
EAR99
Memory Organization
128M x 32
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Obsolete
Supplier Device Package
178-VFBGA (11x11.5)
Write Cycle Time Word Page
15ns
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W63AH2NBVACIWinbond ElectronicsPackage: Tray | Package / Case: 178-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.3V, 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TC) | Organization: 32 M x 32
W63AH6NBVADIWinbond ElectronicsPackage: Tray | Package / Case: 178-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.3V, 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TC) | Organization: 64 M x 16
W63CH6MBVACEWinbond ElectronicsPackage: Tray | Package / Case: 178-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.3V, 1.7V ~ 1.95V | Memory Size: 4Gbit | Operating Temperature: -25°C ~ 85°C (TC)
W63AH2NBVACEWinbond ElectronicsPackage: Tray | Package / Case: 178-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.3V, 1.7V ~ 1.95V | Memory Size: 1Gbit | Operating Temperature: -25°C ~ 85°C (TC) | Organization: 32 M x 32