Winbond Electronics W63BH6MBVABE DRAM
DRAM Chip Mobile LPDDR3 SDRAM 2Gbit 128Mx16 1.2V/1.8V 178-Pin VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W63BH6MBVABE
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 2G
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
W63BH6MBVABE Datasheet
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Technical Specifications
Winbond Electronics W63BH6MBVABE DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Active
HTS
8542.32.00.36
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR3 SDRAM
Memory Size
2G
Organization
128Mx16
Number of Internal Banks
8
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