Winbond Electronics W63AH2NBVADI DRAM
IC DRAM 1GBIT HSUL 12 178VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W63AH2NBVADI
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 1G; Interface: HSUL_12
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
W63AH2NBVADI Datasheet
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Technical Specifications
Winbond Electronics W63AH2NBVADI DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Active
HTS
EA
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR3 SDRAM
Memory Size
1G
Interface
HSUL_12
Min Supply Voltage
1.14/1.7
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