Winbond Electronics W6351G6KB-12 DRAM
DRAM Chip DDR3 SDRAM 512Mbit 32Mx16 1.5V 96-Pin TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W6351G6KB-12
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 512M; Interface: SSTL_15
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
W6351G6KB-12 Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W6351G6KB-12 DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Obsolete
HTS
8542.32.00.28
Automotive
No
Ppap
No
Dram Type
DDR3 SDRAM
Memory Size
512M
Organization
32Mx16
Number of Internal Banks
8
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W9751G6NB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16
W634GU6RB-11Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
W9725G6KB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 256M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 16Mx16
W9751G6NB25IWinbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16