Winbond Electronics W632GU6RB11I DRAM
16M x 8 BANKS x 16 BIT DDR3L SDRAM
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W632GU6RB11I
Detailed Description
Package
VFBGA
Key Features
Mounting Type: Surface Mount; Memory Size: 2G
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W632GU6RB11I DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Active
HTS
8542.32.00.24
Automotive
No
Ppap
No
Dram Type
DDR3L SDRAM
Memory Size
2G
Organization
128Mx16
Number of Internal Banks
8
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W631GU6NB-12Winbond ElectronicsPackage: BGA | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V, 1.425V ~ 1.575V | Memory Size: 1G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96 | Organization: 64Mx16
W631GG6NB-15Winbond ElectronicsPackage: BGA | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 1G | Interface: SSTL_15 | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96
W631GG6NB12IWinbond ElectronicsPackage: BGA | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 1G | Interface: SSTL_15 | Operating Temperature: -40°C ~ 95°C (TC) | Number of Pins: 96
W631GG6NB15IWinbond ElectronicsPackage: BGA | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.4V ~ 1.6V | Memory Size: 1G | Interface: SSTL_15 | Operating Temperature: -40°C ~ 95°C (TC) | Number of Pins: 96