Winbond Electronics W631GU6NB-11I/TRAY DRAM
DRAM Chip DDR3L SDRAM 1Gbit 64Mx16 1.35V 96-Pin VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W631GU6NB-11I/TRAY
Detailed Description
Package
VFBGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 1G
Lifecycle Status
LTB
RoHS State
Compliant
Datasheet
W631GU6NB-11I/TRAY Datasheet
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Technical Specifications
Winbond Electronics W631GU6NB-11I/TRAY DRAM technical specifications.
General
Organization
64Mx16
ECCN
EAR99
Ppap
No
Data Bus Width Bit
16
Operating Current Ma
195
Number of Internal Banks
8
Automotive
No
Address Bus Width Bit
16
Min Operating Temp
-40
Max Operating Temp
95
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W631GU6NB-12Winbond ElectronicsPackage: BGA | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V, 1.425V ~ 1.575V | Memory Size: 1G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96 | Organization: 64Mx16
W631GG6NB-15Winbond ElectronicsPackage: BGA | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 1G | Interface: SSTL_15 | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 96
W631GG6NB12IWinbond ElectronicsPackage: BGA | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 1G | Interface: SSTL_15 | Operating Temperature: -40°C ~ 95°C (TC) | Number of Pins: 96
W631GG6NB15IWinbond ElectronicsPackage: BGA | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.4V ~ 1.6V | Memory Size: 1G | Interface: SSTL_15 | Operating Temperature: -40°C ~ 95°C (TC) | Number of Pins: 96