Winbond Electronics W632GU6QB11I DRAM
2GB DDR3L 1.35V SDRAM, X16, INDU

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W632GU6QB11I
Detailed Description
Package
96-VFBGA (7.5x13)
Key Features
Package: Tray; Package / Case: 96-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.283V ~ 1.45V; Memory Size: 2Gbit
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W632GU6QB11I Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W632GU6QB11I DRAM technical specifications.
General
Max Frequency
933 MHz
Operating Temperature
-40°C ~ 95°C (TC)
Memory Interface
Parallel
Memory Organization
128M x 16
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
96-VFBGA (7.5x13)
Access Time
20 ns
Write Cycle Time Word Page
15ns
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Package: Tray | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 1Gbit | Operating Temperature: 0°C ~ 95°C (TC)
Package: Tray | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 95°C (TC)
Package: Tray | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 1Gbit | Operating Temperature: 0°C ~ 95°C (TC)
Package: Tray | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2Gbit | Operating Temperature: 0°C ~ 95°C (TC) | Organization: 128 M x 16