Winbond Electronics W632GU6NB11I/REEL DRAM
DRAM Chip DDR3L SDRAM 2Gbit 128Mx16 1.35V 96-Pin VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W632GU6NB11I/REEL
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 2G
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
W632GU6NB11I/REEL Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W632GU6NB11I/REEL DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Obsolete
Automotive
No
Ppap
No
Dram Type
DDR3L SDRAM
Memory Size
2G
Organization
128Mx16
Number of Internal Banks
8
Number of Words Per Bank
16M
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W9751G6NB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16
W634GU6RB-11Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
W9725G6KB-25Winbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 256M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 16Mx16
W9751G6NB25IWinbond ElectronicsPackage: BGA | Mounting Type: Surface Mount | Memory Size: 512M | Interface: SSTL_18 | Number of Pins: 84 | Organization: 32Mx16