Winbond Electronics W632GU6NB09I DRAM
IC DRAM 2GBIT PAR 96VFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W632GU6NB09I
Detailed Description
Package
96-VFBGA (7.5x13)
Key Features
Package: Tray; Package / Case: 96-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.283V ~ 1.45V; Memory Size: 2Gbit
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W632GU6NB09I DRAM technical specifications.
General
Max Frequency
1.067 GHz
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
96-VFBGA (7.5x13)
Access Time
20 ns
Package / Case
96-VFBGA
Technology
SDRAM - DDR3L
Supply Voltage
1.283V ~ 1.45V
Reach Status
REACH Unaffected
Mfr
Winbond Electronics
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Package: Tray | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 1Gbit | Operating Temperature: 0°C ~ 95°C (TC)
Package: Tray | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 95°C (TC)
Package: Tray | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 1Gbit | Operating Temperature: 0°C ~ 95°C (TC)
Package: Tray | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2Gbit | Operating Temperature: 0°C ~ 95°C (TC) | Organization: 128 M x 16