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Winbond Electronics W632GG6KB15J DRAM

IC DRAM 2GBIT PARALLEL 96WBGA

210 ActiveWinbond Electronics96-TFBGA$9.70
W632GG6KB15J - No Image Available

Same model may have multiple batches, images only for reference.

W632GG6KB15J
Part Number (MPN)
W632GG6KB15J
Detailed Description
IC DRAM 2GBIT PARALLEL 96WBGA
Package
96-TFBGA
Lifecycle Status
Active
Datasheet
PDF W632GG6KB15J Datasheet
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Technical Specifications

Winbond Electronics W632GG6KB15J DRAM technical specifications.

General

Memory Size
2Gb (128M x 16)
Package / Case
96-TFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TC)
Supply Voltage
1.425V ~ 1.575V
MSL Level
3 (168 Hours)
Quantity Per Package
190
Operating Temperature Range
-40°C ~ 105°C (TC)
Features
SDRAM - DDR3 Memory IC 2Gb (128M x 16) Parallel 667 MHz 20 ns 96-WBGA (9x13)
Package
96-TFBGA

Alternate Parts Comparison (W632GG6KB15J vs W9825G6KH-6 vs W9751G6KB-25 vs W9816G6IH-6)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TC)0 ~ 700°C ~ 85°C (TC)0°C ~ 70°C (TA)
Supply Voltage1.425V ~ 1.575V3 ~ 3.61.7V ~ 1.9V3V ~ 3.6V
Memory Size2Gb (128M x 16)256M512 Mbit16 Mbit
Package / Case96-TFBGA--84-TFBGA50-TSOP
Access Time20 ns--57.5 ns5 ns
Max Frequency667 MHz--400 MHz166 MHz
Memory FormatDRAM--DRAMDRAM
Memory InterfaceParallel--ParallelParallel
Memory TypeVolatile--VolatileVolatile
TechnologySDRAM - DDR3--SDRAM - DDR2SDRAM
Lifecycle Status--ActiveObsoleteObsolete
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