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Winbond Electronics W632GG6KB-12 Memory ICs

IC DRAM 2GBIT PARALLEL 96WBGA

1,520Winbond ElectronicsW632GG96-TFBGA$13.14
W632GG6KB-12 - No Image Available

Same model may have multiple batches, images only for reference.

W632GG6KB-12
Part Number (MPN)
W632GG6KB-12
Base Model
Detailed Description
IC DRAM 2GBIT PARALLEL 96WBGA
Package
96-TFBGA
Lifecycle Status
Obsolete
Datasheet
PDF W632GG6KB-12 Datasheet
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Ordering Code Family

W632GG groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

5 ordering variants listed on the family page.

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Technical Specifications

Winbond Electronics W632GG6KB-12 Memory ICs technical specifications.

General

Manufacturer
Winbond Electronics
Memory Size
2Gb (128M x 16)
RoHS
ROHS3 Compliant
Package / Case
96-TFBGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 95°C (TC)
Supply Voltage
1.425V ~ 1.575V
Lifecycle Status
Discontinued at Digi-Key
Package
96-TFBGA
Technology
SDRAM - DDR3

Alternate Parts Comparison (W632GG6KB-12 vs W632GG6NB12I vs W632GG8NB-12 vs W632GG6NB09I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
ManufacturerWinbond ElectronicsWinbond ElectronicsWinbond ElectronicsWinbond Electronics
Package / Case96-TFBGA96-VFBGA78-VFBGA96-VFBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 95°C (TC)-40°C ~ 95°C (TC)0°C ~ 95°C (TC)-40°C ~ 95°C (TC)
Supply Voltage1.425V ~ 1.575V1.425V ~ 1.575V1.425V ~ 1.575V1.425V ~ 1.575V
Memory Size2Gb (128M x 16)2Gbit2Gbit2Gbit
RoHSROHS3 CompliantROHS3 CompliantROHS3 CompliantROHS3 Compliant
Lifecycle StatusDiscontinued at Digi-KeyActiveActiveActive
Access Time20 ns20 ns20 ns20 ns
Base Product NumberW632GG6W632GG6W632GG8W632GG6
Max Frequency800 MHz800 MHz800 MHz1.067 GHz
Memory FormatDRAMDRAMDRAMDRAM
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