Winbond Electronics W632GG6KB-11 DRAM
IC DRAM 2GBIT PAR 96WBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W632GG6KB-11
Detailed Description
Package
96-WBGA (9x13)
Key Features
Package: Tray; Package / Case: 96-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.425V ~ 1.575V; Memory Size: 2Gbit
Lifecycle Status
Discontinued at Digi-Key
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W632GG6KB-11 DRAM technical specifications.
General
Max Frequency
933 MHz
Inventory Source
Winsource
Inventory Source File
/Volumes/T7 Shield/电子元器件数据/抓取的数据/Win-Source数据/winsource_未曾下架数据_202605_1.xlsx
Inventory As of
2026-05-15
Source Manufacturer
Winbond Electronics
Source Category
Integrated Circuits (ICs) > Memory
Stock
1732
Extracted Price
4.4714
Price Formula
winsource min price * 2
Memory Type
Volatile
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Package: Tray | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2Gbit | Operating Temperature: 0°C ~ 95°C (TC)
Package: Tray | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.425V ~ 1.575V | Memory Size: 1Gbit | Operating Temperature: 0°C ~ 85°C (TC)
Package: Tray | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 95°C (TC)
Package: Tray | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 1Gbit | Operating Temperature: 0°C ~ 95°C (TC)