Winbond Electronics W25Q512NWBIQ Flash Memory
IC FLASH 512MBIT SPI 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q512NWBIQ
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 24-TBGA; Mounting Type: Surface Mount; Supply Voltage: 1.65V ~ 1.95V; Memory Size: 512Mb (64M x 8)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
W25Q512NWBIQ Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25Q512NWBIQ Flash Memory technical specifications.
General
RoHS
Compliant
Lifecycle Status
Active
HTS
EA
Automotive
No
Ppap
No
Mounting Type
Surface Mount
Package Height
0.85
Package Width
6
Package Length
8
Package
BGA
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W25Q128JVCIQWinbond ElectronicsPackage: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 128M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 24
W29GL128CH9CWinbond ElectronicsPackage: BGA | Package / Case: 56-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 128M | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 56
W71NW20GD3DWWinbond ElectronicsPackage: BGA | Package / Case: 130-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2Gb (NAND), 1Gb (LPDDR) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 130 | Organization: 16Mx8 Flash + 2Mx32 DDR DRAM
W25Q32JVTCIMWinbond ElectronicsPackage: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 32M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 24