Winbond Electronics W25Q512NWBIM Flash Memory
IC FLASH 512MBIT SPI 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q512NWBIM
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 24-TBGA; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 512M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25Q512NWBIM Flash Memory technical specifications.
General
RoHS
Compliant
Lifecycle Status
Active
HTS
8542.32.00.71
Cell Type
NOR
Memory Size
512M
Architecture
Sectored
Boot Block
No
Block Organization
Symmetrical
Address Width Bit
32
Sector Size
4Kbyte x 16384
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