Winbond Electronics W25Q32FVZEIG Flash Memory
IC FLASH 32MBIT SPI/QUAD 8WSON
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q32FVZEIG
Detailed Description
Package
SON
Key Features
Package: SON; Package / Case: 8-WDFN Exposed Pad; Mounting Type: Surface Mount; Supply Voltage: 3/3.3; Memory Size: 32M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
W25Q32FVZEIG Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25Q32FVZEIG Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Obsolete
HTS
COMPONENTS
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
32M
Architecture
Sectored
Boot Block
No
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W25X05CLUXIGWinbond ElectronicsPackage: SON | Mounting Type: Surface Mount | Supply Voltage: 2.5/3.3 | Memory Size: 512K | Interface: Serial (SPI, Dual SPI) | Number of Pins: 8
W25X20CLUXIGWinbond ElectronicsPackage: SON | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 2M | Interface: Serial (SPI, Dual SPI) | Number of Pins: 8
W25Q16JWZPIQWinbond ElectronicsPackage: SON | Package / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 1.8 | Memory Size: 16M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 8
W25N02KVZEIRWinbond ElectronicsPackage: SON | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 2G | Interface: Serial (SPI, Dual SPI, Quad SPI) | Number of Pins: 8