Winbond Electronics W25Q256FVBIF Flash Memory
IC FLASH 256MBIT SPI 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q256FVBIF
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 24-TBGA; Mounting Type: Surface Mount; Supply Voltage: 3.3; Memory Size: 256M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
NRND
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W25Q256FVBIF Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991.b.1.a
Lifecycle Status
NRND
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
256M
Architecture
Sectored
Boot Block
No
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