Winbond Electronics W25Q16JWSSIM Flash Memory
IC FLASH 16MBIT SPI/QUAD 8SOIC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q16JWSSIM
Detailed Description
Package
SO
Key Features
Package: SO; Package / Case: 8-SOIC (0.209", 5.30mm Width); Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 16M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W25Q16JWSSIM Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Active
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
16M
Architecture
Sectored
Boot Block
Yes
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