Winbond Electronics W25Q02NWTBIM Flash Memory
SPIFLASH, 2G-BIT, 4KB UNIFORM SE
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q02NWTBIM
Detailed Description
Package
TFBGA
Key Features
Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
Winbond Electronics W25Q02NWTBIM Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991
Lifecycle Status
Active
HTS
EA
Mounting Type
Surface Mount
Package Height
0.85
Package Width
6
Package Length
8
Supplier Package
TFBGA
Number of Pins
24
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W25N02JWTBIFWinbond ElectronicsPackage: Tray | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 2G | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 24
W35N01JWTBIGWinbond ElectronicsMounting Type: Surface Mount | Number of Pins: 24 | RoHS: Compliant | ECCN: 3A991 | Lifecycle Status: Active | HTS: EA
W25Q16FWSNIQWinbond ElectronicsPackage: Tray | Package / Case: 8-SOIC (0.154", 3.90mm Width) | Mounting Type: Surface Mount | Supply Voltage: 1.65V ~ 1.95V | Memory Size: 16Mbit | Operating Temperature: -40°C ~ 85°C (TA)
W25Q64JVSSIQWinbond ElectronicsPackage: SO | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 64M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Number of Pins: 8