Winbond Electronics W25M02GVZEIG Memory ICs
2G-BIT SERIAL NAND FLASH, 3V
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25M02GVZEIG
Base Model
Detailed Description
Package
8-WDFN Exposed Pad
Key Features
Package: 8-WDFN Exposed Pad; Supply Voltage: 2.7V ~ 3.6V; Memory Size: 2Gb (256M x 8)
Lifecycle Status
Obsolete
RoHS State
Unknown
Datasheet
W25M02GVZEIG Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25M02GVZEIG Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package
8-WDFN Exposed Pad
Technology
FLASH - NAND (SLC)
Supplier Device Package
8-WSON (8x6)
Memory Size
2Gb (256M x 8)
Memory Type
Non-Volatile
Supply Voltage
2.7V ~ 3.6V
Max Frequency
104 MHz
Access Time
7 ns
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W25M161AVEITWinbond ElectronicsPackage / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 1G NAND+16M NOR | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 8
W25M02GVTCIGWinbond ElectronicsPackage: Tray | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 85°C (TA)