Samsung Semiconductor K4B4G0846E-BYMA0CV DRAM
DRAM Chip DDR3L SDRAM 4Gbit 512Mx8 1.35V/1.5V 78-Pin FBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4B4G0846E-BYMA0CV
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 4G
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
K4B4G0846E-BYMA0CV Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4B4G0846E-BYMA0CV DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Obsolete
Automotive
No
Ppap
No
Dram Type
DDR3L SDRAM
Memory Size
4G
Organization
512Mx8
Number of Internal Banks
8
Number of Words Per Bank
64M
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
K4B2G1646F-BYK0Samsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 2G | Number of Pins: 96 | Organization: 128Mx16
K4B4G1646D-BYK0Samsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4B4G1646D-BHMASamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4E6E304EC-EGCGSamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 16G | Number of Pins: 178 | Organization: 512Mx32