Renesas UPD70F3529GMA9-GBK-Q-G Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 2GB FLASH 176HLQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
UPD70F3529GMA9-GBK-Q-G
Detailed Description
Package
176-LQFP Exposed Pad
Key Features
Package / Case: 176-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
UPD70F3529GMA9-GBK-Q-G Datasheet
Quick Jump:
Technical Specifications
Renesas UPD70F3529GMA9-GBK-Q-G Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
176-LQFP Exposed Pad
Supplier Device Package
176-HLQFP (24x24)
Peripherals
DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O
127
Speed
80MHz
EEPROM Size
32K x 8
Core Processor
V850E2M
RAM Size
96K x 8
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.