Renesas UPD70F3525GJA9-608-GAE-Q-H Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT FLASH SMD
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
UPD70F3525GJA9-608-GAE-Q-H
Detailed Description
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
UPD70F3525GJA9-608-GAE-Q-H Datasheet
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Technical Specifications
Renesas UPD70F3525GJA9-608-GAE-Q-H Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LFQFP (20x20)
Peripherals
DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O
105
Speed
120MHz
EEPROM Size
32K x 8
Core Processor
V850E2M
RAM Size
192K x 8
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