Renesas UPD70F3370AM2GBA1-GAH-E3-QS-AX Microcontroller, Microprocessor, FPGA Modules
IC MCU
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
UPD70F3370AM2GBA1-GAH-E3-QS-AX
Detailed Description
Package
64-LQFP
Key Features
Package / Case: 64-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
UPD70F3370AM2GBA1-GAH-E3-QS-AX Datasheet
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Technical Specifications
Renesas UPD70F3370AM2GBA1-GAH-E3-QS-AX Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 110°C (TA)
Mounting Type
Surface Mount
Package / Case
64-LQFP
Supplier Device Package
64-LFQFP (10x10)
Peripherals
DMA, LVD, POR, PWM, WDT
Number of I/O
51
Speed
32MHz
EEPROM Size
32K x 8
Core Processor
V850ES
RAM Size
8K x 8
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